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Low temperature cofiring ceramic tape (LTCC) is increasingly used for the production of complex three‐dimensional multilayer interconnect structures in microelectronics packaging. LTCC technology offers many attractive features including mechanical strength, high temperature performance, hermeticity and, with advanced crystallisable ceramic compositions, such as the Ferro A6 tape, outstanding microwave performance. Key among properties that discriminate LTCC technology from competing packaging approaches are two features that allow both design flexibility and maximum integratability: the ability to integrate the full range of passive components — resistors, capacitors and inductors — within the monolithic LTCC structure: and the fact that the LTCC interconnect system provides not only the interchip connection but also the package itself for the components, that is, the LTCC does not have to be placed in a further level of packaging before use. In this paper, the flexibility of design achievable with this company's A6 tape system including integratable passive components is discussed. Design rules that should be observed with the system to ensure that maximum benefit can be obtained from the key performance characteristics of the LTCC materials are addressed. Data supporting these design considerations are presented, as is a review of production processing parameters and their effect on yield, performance and cost of modules produced using the system. Specific project examples are reviewed to demonstrate the applications of this technology in advanced packaging design.

This paper aims to test the volatility and analyses the macroeconomic determinants of house price volatility in Namibia over the period 2007 Quarter 1 to 2017 Quarter 2. It further explores the causal relations between house price volatility and its determinants.

The study used autoregressive conditional heteroskedastic and generalized autoregressive conditional heteroskedastic models to test for volatility. The vector error correction model was used to analyse the determinants and causal relations.

The results support the hypothesis that house prices in Namibia exhibits persistent volatility. It was further established that past period volatility’ GDP and mortgage loans are the key determinants of house price volatility. Additionally’ there exists unidirectional causality from GDP and mortgage loans to house price volatility.

Policy implications emanating from the study implies that macroeconomic fundamentals should be monitored closely to mitigate the issues of house price volatility.

The study is the first of its kind in Namibia to address the pertinent issues of ever increasing housing prices.

This paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors (with designed dimensions between 50 × 50 μm² and 800 × 200 μm²).

The geometrical parameters (average length, width and thickness, relations between designed and real dimensions, distribution of planar dimensions) are correlated with basic electrical properties of resistors (sheet resistance and its distribution, hot temperature coefficient of resistance and its distribution distribution) as well as long term thermal stability and durability of microresistors to short electrical pulses.

Fodel process gives better resolution than standard screen‐printing and leads to smaller dimensions than designed, smaller absolute error and better uniformity of planar sizes. Microresistors made in full Fodel process show much weaker dimensional effect and exhibit noticeably smaller distribution of basic electrical properties.

Presents systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors.

Workplace voice is well-established and encompasses behaviors such as prosocial voice, informal complaints, grievance filing, and whistleblowing, and it focuses on interactions between the employee and supervisor or the employee and the organizational collective. In contrast, our chapter focuses on employee prosocial advocacy voice (PAV), which the authors define as prosocial voice behaviors aimed at preventing harm or promoting constructive changes by advocating on behalf of others. In the context of a healthcare organization, low quality and unsafe patient care are salient and objectionable states in which voice can motivate actions on behalf of the patient to improve information exchanges, governance, and outreach activities for safer outcomes. The authors draw from the theory and research on responsibility to intersect with theories on information processing, accountability, and stakeholders that operate through voice between the employee-patient, employee-coworker, and employee-profession, respectively, to propose a model of PAV in patient-centered healthcare. The authors complete the model by suggesting intervening influences and barriers to PAV that may affect patient-centered outcomes.

The members of the chapter at the annual meeting held on 27 November 1992 in Brno decided not to split after the separation of Czechoslovakia. It was suggested to organise a larger chapter from the Central European States to provide greater co‐operation and better functioning of the smaller chapters. A new name for the chapter was proposed — Central European Chapter (CEC) — to express neutrality and to point out that the chapter is open to other neighbouring chapters and to new members from the states where no national chapter yet exists.

At the Annual General Meeting of ISHM‐France, held on 12 June 1991, the following were elected:

Dates: 23–24 March 1994 Venue: Palais des Congrès, Porte Maillot, Paris The Fifth Microelectronics Salon (Hybrids, SMT, ASICs, Packaging) will take place on the above dates. This showcase for manufacturers, suppliers of products and equipment, and sub‐contractors to all sectors of these industries will be accompanied by a series of conferences.

‘Soldering and Cleaning in Electronics’ international conference, including an exposition, took place in Brno on 12–13 October 1993. The conference was organised by SMT‐Info, together with the ISHM‐Czech and Slovak Chapter. The purpose of this common action was to bring together the professionals in surface mount technology and thick film technology. In the framework of the conference, in which 130 home and foreign delegates participated, the annual meeting of the ISHM‐Czech and Slovak Chapter took place.